CEA-Leti Innovation Days | Austin

The Semiconductor Revolution Behind AI Factories

Step into the future of the semiconductor industry

This invitation-only event brings together semiconductor and advanced technology leaders to explore the innovations
powering the next generation of AI factories. Co-organized by the French-American Chamber of Commerce in partnership
with Google, the CEA-Leti Innovation Day (LID) offers strategic insights and concrete industrial use cases in an
international, innovation-driven context.

📅 March 10, 2026 | 5:00 PM
📍 Google, 500 W 2nd Street, Austin, TX
🔒 Registration required

First Look at Speaker Lineup Preview

• CEA-Leti
  • Sébastien Dauvé, Chief Executive Officer
  • Michaël Tchagaspanian, Executive Vice President
  • Additional CEA-Leti executives delivering concrete, industry-driven use case presentations
• Google
  • Jim Anderson, Vice President, North America Partner Ecosystem & Channels
• GlobalFoundries
  • Thomas Barber, Vice President, Communications Infrastructure & Datacenter
• Guests of Honor
  • Frank Marchetti, Consul General of France
  • Stephen Davis, Director, CHIPS Office

Topics

• Semiconductor innovations enabling AI factories
• Advanced hardware, performance scaling, and system-level integration
• Applied research and industrial use cases at the frontier of innovation
• Cross-perspectives between Google and French semiconductor leaders
• Formats: Panels, Keynote, Fireside Chats & Networking Cocktail

Who Should Attend?

This event is reserved for semiconductor and advanced technology professionals, including:

• Senior executives and decision-makers
• Industry, R&D, and innovation leaders

Registration is mandatory; no walk-ins will be accommodated. Attendance is moderated.

About CEA-Leti

• CEA has over 22,000 employees worldwide, forming a leading international research community.
• Deep collaboration with universities, startups, multinational corporations, and public institutions.
• CEA-Leti is CEA’s flagship institute dedicated to advanced electronics, micro- and nanotechnologies, and system miniaturization.

.lid {
–primary: #0A2E5D;
–text: #333;
–muted: #666;
font-family: Arial, Helvetica, sans-serif;
color: var(–text);
line-height: 1.6;
font-size: 15px; /* unified base size */
}
/* Titles */
.lid-title {
color: var(–primary);
font-size: 22px;
font-weight: 700;
margin-bottom: 6px;
}
.lid-subtitle {
font-size: 16px;
color: var(–muted);
margin-top: 0;
margin-bottom: 14px;
}
.lid-section {
color: var(–primary);
font-size: 17px; /* consistent across all sections */
font-weight: 700;
margin-bottom: 8px;
}
/* Text blocks */
.lid-text {
margin-bottom: 12px;
}
.lid-meta {
background: #F4F7FB;
border-left: 4px solid var(–primary);
padding: 10px 14px;
margin-bottom: 14px;
}
.lid-note {
font-size: 14px;
color: var(–muted);
}
/* Lists */
.lid-list,
.lid-list-flat {
margin-left: 18px;
margin-bottom: 12px;
}
.lid-list li,
.lid-list-flat li {
margin-bottom: 6px;
}
.lid-company {
color: var(–primary);
font-weight: 700;
}
hr {
border: none;
border-top: 1px solid #E2E2E2;
margin: 18px 0;
}